(Wiley Series on Processing of Engineering Materials) 1st Edition
by Takahiko Kato (Editor), Carol A. Handwerker (Editor), Jasbir Bath (Editor)
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks
This
book covers key tin whisker topics, ranging from fundamental science to
practical mitigation strategies. The text begins with a review of the
characteristic properties of local microstructures around whisker and
hillock grains to identify why these particular grains and locations
become predisposed to forming whiskers and hillocks. The book discusses
the basic properties of tin-based alloy finishes and the effects of
various alloying elements on whisker formation, with a focus on
potential mechanisms for whisker suppression or enhancement for each
element. Tin whisker risk mitigation strategies for each tier of the
supply chain for high reliability electronic systems are also described.
- Discusses
whisker formation factors including surface grain geometry,
crystallographic orientation-dependent surface grain boundary structure,
and the localization of elastic strain/strain energy density
distribution
- Examines how whiskers and hillocks evolve in time
through real-time studies of whisker growth with the scanning electron
microscope/focused ion beaming milling (SEM/FIB)
- Covers
characterization methods of tin and tin-based alloy finishes such as
transmission electron microscopy (TEM), scanning electron microscopy
(SEM), and electron backscatter diffraction (EBSD)
- Reviews
theories of mechanically-induced tin whiskers with case studies using
pure tin and other lead-free finishes shown to evaluate the
pressure-induced tin whiskers
Mitigating Tin Whisker Risks: Theory and Practice is
intended for the broader electronic packaging and manufacturing
community including: manufacturing engineers, packaging development
engineers, as well as engineers and researchers in high reliability
industries.
