BOOK DOWNLOAD

Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management

20.00$
Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management
BOOK DOWNLOAD

Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management

20.00$

1st Edition

by Paul D. Franzon (Editor), Erik Jan Marinissen (Editor), Muhannad S. Bakir (Editor)

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.

Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Year:
2019
Pages:
479
Language:
English
Format:
PDF
Size:
27 MB
Publisher:
Wiley-VCH
ISBN-10:
3527338551
ISBN-13:
978-3527338559
ASIN:
B07N5163KF
Tag:
Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management