1st Edition
by Er-Ping Li (Author)
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems
Based
on the author's extensive research, this book sets forth tested and
proven electromagnetic modeling and simulation methods for analyzing
signal and power integrity as well as electromagnetic interference in
large complex electronic interconnects, multilayered package structures,
integrated circuits, and printed circuit boards. Readers will discover
the state of the technology in electronic package integration and
printed circuit board simulation and modeling. In addition to popular
full-wave electromagnetic computational methods, the book presents new,
more sophisticated modeling methods, offering readers the most advanced
tools for analyzing and designing large complex electronic structures.
Electrical Modeling and Design for 3D System Integration
begins with a comprehensive review of current modeling and simulation
methods for signal integrity, power integrity, and electromagnetic
compatibility. Next, the book guides readers through:
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The
macromodeling technique used in the electrical and electromagnetic
modeling and simulation of complex interconnects in three-dimensional
integrated systems
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The semi-analytical scattering
matrix method based on the N-body scattering theory for modeling of
three-dimensional electronic package and multilayered printed circuit
boards with multiple vias
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Two- and three-dimensional
integral equation methods for the analysis of power distribution
networks in three-dimensional package integrations
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The
physics-based algorithm for extracting the equivalent circuit of a
complex power distribution network in three-dimensional integrated
systems and printed circuit boards
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An equivalent circuit model of through-silicon vias
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Metal-oxide-semiconductor capacitance effects of through-silicon vias
Engineers,
researchers, and students can turn to this book for the latest
techniques and methods for the electrical modeling and design of
electronic packaging, three-dimensional electronic integration,
integrated circuits, and printed circuit boards.
